OpenLight and TFC Breakthrough in Post-Processing Integration of Silicon Photonics, TGV Technology Achieves New Milestone in 400G High-Speed Optical Communication
OpenLight collaborates with TFC to break through backend integration technology in silicon photonics, successfully achieving a TGV-based substrate solution for 400G high-speed data transmission, enhancing packaging efficiency and signal reliability. This technology significantly improves interconnect density, making it suitable for high-performance computing and data centers. With its advantages in optical packaging, Guangpu Electronics is expected to play a more significant role in the high-end optical module market, driving the intelligent development of the industry.
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