
EVG Leads the New Trend in Heterogeneous Integration, with Hybrid Bonding and Maskless Lithography Technologies Driving LEDs and Advanced Packaging Toward High Performance and Miniaturization
At ECTC 2026, EVG will showcase its advanced packaging technologies, including hybrid bonding, layer transfer, and maskless lithography, to support the development of LED and Micro-LED. These technologies enhance performance, reduce costs, and drive the industry toward higher density and miniaturization. With the rapid growth of the Micro-LED market, EVG's solutions have become a critical enabler, helping companies strengthen their competitiveness.
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